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Filament › Filament› Print temperatureeng_plate_temp_initial_layer

Bed on the Engineering Plate: initial layer

The bed temperature for the first layer when you use the Engineering Plate. 0 means the filament doesn't support that plate.

How it works

Each plate has its own row of temperatures, and the program uses the one for the plate you pick in Prepare. That's why it pays to pick the one actually on the printer: the same filament can need 35 °C on one plate and 65 °C on another.

It's for engineering materials. In PLA Basic it's 0: this filament doesn't support it. This value is for the first layer only: a hotter bed at the start helps it grip. In PLA Basic it's the same as for the other layers.

When to change it

  • With PLA Basic it's 0: don't use this plate with PLA.
  • With an engineering material that does support it (ABS and ASA, for example), its profile has the temperature.

Typical values

ValueWhat for
0PLA Basic: not supporteddefault
90 °CABS and ASA (base profile)

Watch out for

  • Clean the plate before raising the temperature: finger grease unsticks more than a few degrees too few.
  • Hotter doesn't always stick better: past a certain point the base softens and deforms.

Goes well with

What Bambu Studio saysits help card, quoted

What Bambu Studio says

Bed temperature of the initial layer. Value 0 means the filament does not support to print on the Engineering Plate

Bambu Studio tooltip for this setting · AGPL-3.0

Read more at the official source

In your profileBambu PLA Basic @BBL A1 · 0 °C

In Bambu Studio, the profile Bambu PLA Basic @BBL A1 sets it to0 °C

In other slicers

Orca Slicer
First layer bed temperatureFilament › Bed temperature › Engineering Plate
PrusaSlicer
First layer bed temperatureFilament › Temperature › BedPrusa has a single bed temperature, whatever the plate type.
Cura
Build Plate Temperature Initial LayerMaterialCura has a single build plate temperature, whatever the plate type.

Names taken from each program's code (Orca Slicer 2.4.2, PrusaSlicer 2.9.6, Cura 5.13.0). Credits